Next-generation DRAM produced by ChangXin Memory Technologies (CXMT), China's largest DRAM maker, is set to be used in Xiaomi's latest processor, according to reports.
Chinese outlets including The Beijing News reported on the 25th, citing supply chain sources, that Xiaomi's flagship mobile system-on-chip, the XRING O3, will be the world's first to support LPDDR6, the next-generation DRAM standard, and that CXMT's LPDDR6 has been adopted for official commercialization.
LPDDR is a low-power DRAM standard used in mobile devices such as smartphones and tablets, as well as in on-device artificial intelligence. As LPDDR6, the sixth generation, emerges as the next standard for low-power mobile memory, Korean companies including Samsung Electronics and SK hynix are competing for leadership. SK hynix said in March that it had successfully developed a 16-gigabit LPDDR6 chip using its 10-nanometer-class sixth-generation, or 1c, process, and Samsung Electronics showcased LPDDR6 products at CES 2026.
But analysts say China's semiconductor ecosystem is growing stronger as CXMT, which expanded rapidly in the commodity DRAM market, narrows the gap in advanced DRAM as well and moves into domestically designed processors. The Beijing News said CXMT began supplying LPDDR6 samples to key customers in March and that validation was in its final stages as of August. Securing a place in Xiaomi's chip marks the first time China has taken an early global lead in the competition over advanced low-power memory, the outlet said.
