LG Chem to Showcase AI Chip Packaging Materials at SEMICON Taiwan

Asia's Largest Semiconductor Show Runs Sept. 2-4 in Taipei LG Chem Aims to Expand Ties With Major Industry Players

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By Yoo Hyun-wookabc@sedaily.com
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Aerial view of LG Chem's SEMICON Taiwan 2026 booth - Seoul Economic Daily Finance News from South Korea
Aerial view of LG Chem's SEMICON Taiwan 2026 booth

LG Chem (051910.KS) said on the 26th that it will take part in SEMICON Taiwan 2026, Asia's largest semiconductor exhibition, to win new chip customers and expand business partnerships.

SEMICON Taiwan is the largest semiconductor exhibition in Asia, showcasing next-generation chip technology trends such as advanced packaging and artificial intelligence chips. It draws a wide range of global industry players, including chipmakers, outsourced semiconductor assembly and test (OSAT) firms, and substrate and packaging companies, who gather to discuss technology exchanges and business cooperation. This year's event runs Sept. 2-4 at the Nangang Exhibition Center in Taipei.

LG Chem will set up a booth to present advanced packaging materials for AI chips, including high-bandwidth memory (HBM), as well as power semiconductor material solutions.

In the Advanced Package Zone, which highlights advanced packaging materials for AI chips, the company will display a range of materials used in advanced packaging processes, including copper clad laminates, glass core solutions, build-up films, film-type solder resists, photosensitive insulation materials, die attach films, bonding and debonding solutions, and strippers for fine-process applications.

In the Power Package Zone, LG Chem will present core materials that improve chip performance by boosting the efficiency and heat management of power semiconductors for AI data centers, including conductive sintering paste, thermal interface materials, and copper metal foam-based thermal management device solutions.

LG Chem plans to use the exhibition to expand cooperation with major chipmakers, OSAT firms, and substrate and packaging companies. Through technology exchanges and the discovery of new projects, the company aims to broaden its customer base in the AI chip and advanced packaging markets and accelerate growth in its semiconductor materials business.

"Based on our differentiated materials portfolio, LG Chem will expand cooperation with semiconductor customers and actively seize growth opportunities in the future chip market," said LG Chem CEO Kim Dong-chun.

Original reporting by Yoo Hyun-wook for Seoul Economic Daily.

AI-translated from Korean. Quotes from foreign sources are based on Korean-language reports and may not reflect exact original wording.

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