Lisa Su Says "Almost There" as Samsung Nears AMD HBM4 Deal

*Editor's Note: 'AI PRISM' (Personalized Report & Insight Summarizing Media) is an "AI-based personalized news recommendation and summary service" developed with support from the Korea Press Foundation. It selects and provides six customized news items by reader type.

1. [Exclusive] Lisa Su Pulls Out New Weapon…"Final HBM4 Contract with Samsung Imminent"

- Key Summary: A final contract between AMD and Samsung Electronics for HBM4 (sixth-generation high-bandwidth memory) appears imminent. AMD Chief Executive Officer Lisa Su said on the 23rd at the "AMD Advancing AI 2026" event held in San Francisco that HBM4 supply negotiations with Samsung Electronics are "almost reached." Following a memorandum of understanding (MOU) signed in March after visiting Samsung Electronics' Pyeongtaek campus, the two appear to have entered the stage of finalizing supply volumes through a formal contract. AMD plans to ship its "Helios" AI server rack from the end of the third quarter, with OpenAI, Anthropic, and Microsoft already secured as customers.

2. Kim Yong-beom: "Meaningful Numbers, Not MOUs"…Will Samsung and SK Land Mega Long-Term Contracts with U.S. Big Tech?

- Key Summary: On the occasion of President Lee Jae-myung's U.S. visit, the possibility of mega-scale long-term agreements (LTAs) between domestic companies and U.S. big tech firms has been raised. Policy Chief Kim Yong-beom said at a briefing on the 22nd, "There will be many meaningful numbers coming out, not just simple MOUs between companies, but investment attraction, strategic alliances, and long-term contracts." On the 24th, President Lee is scheduled to hold successive meetings with the CEOs of Anthropic, OpenAI, Nvidia, and Broadcom, before attending the San Francisco AI Summit alongside Samsung Electronics Chairman Jay Y. Lee and SK Chairman Chey Tae-won. Kim added that concrete contract volumes on the scale of gigawatts (GW) could be announced across three major areas: semiconductors, AI data centers (AIDC), and physical AI.

3. Amid CXMT IPO Hopes…Three-Month Return Hits 31%

- Key Summary: On news that Chinese memory maker ChangXin Memory Technologies (CXMT) is pursuing an initial public offering (IPO), returns on China AI semiconductor-related ETFs surged. The "KODEX China AI Semiconductor TOP10 ETF" posted a three-month return of 31.62% as of the 24th, with a cumulative return of 51.83% since its listing in February this year. The gains are seen as reflecting improved investor sentiment toward China's AI semiconductor industry following news that CXMT is pursuing a listing on the Shanghai Stock Exchange's STAR Market. The ETF holds a broad range of AI semiconductor, server component, and data storage companies including Hygon Information Technology and Cambricon Technologies.

4. Amkor, Packaging Powerhouse Chosen by Nvidia, Breaks Through AI Chips' "Hidden Bottleneck"

- Key Summary: Amkor Technology's shares surged after Nvidia signed a 2 trillion won advanced packaging contract with the semiconductor back-end company. According to Bloomberg, Nvidia signed a contract worth 1.5 billion dollars (about 2.2 trillion won), including an advance payment, with Amkor to expand semiconductor production in the United States, and on the news, Amkor shares jumped 17% in after-hours trading. Amkor already has a 10-year long-term partnership with TSMC and is also conducting packaging collaboration with AMD, emerging as a key axis in the reorganization of the semiconductor supply chain within the United States. However, since Asian companies in Taiwan, China, and Korea account for about 90% of the semiconductor back-end market, Amkor's market share remains relatively low.