Hanmi Semiconductor (042700.KS) has launched a new piece of equipment, the "2.5D Thermal Compression (TC) Bonder 40," which supports the 2.5-dimensional (2.5D) packaging process for artificial intelligence (AI) semiconductors, and will supply it to global foundry and outsourced semiconductor assembly and test (OSAT) companies, the company said Thursday.
2.5D packaging is a process that big tech firms including Nvidia, AMD and Broadcom are actively adopting to produce their AI semiconductors. It supports the ultra-large die and multi-chip integration processes essential for implementing AI semiconductors. Global foundry companies have also developed 2.5D packaging process technologies, including TSMC's CoWoS and Intel's EMIB.
Hanmi Semiconductor's 2.5D TC Bonder 40 is specialized for CoWoS's "chip on wafer" process. The company explained that it can handle a wide range, from ultra-small dies measuring 3 millimeters to ultra-large dies measuring 40 millimeters. The equipment applies "auto conversion" technology, which allows continuous work on various types of chips without stopping, "reel feeder loading," which maximizes equipment operating efficiency, and "fluxless bonding," which reduces fine defects.
Hanmi Semiconductor said it expects to grow its 2.5D packaging equipment business in earnest by establishing a local subsidiary, "Hanmi USA," in the United States, where big tech firms are concentrated, at the end of this year. The company plans to expand its supply chain by building partnerships from the chip planning stage through strengthening its capabilities in the U.S. market, where AI big tech, foundry, OSAT and memory hubs are gathered.
"We plan to expand our overwhelming influence in the explosively growing system semiconductor 2.5D packaging market as well," a Hanmi Semiconductor official said. "We will achieve continuous revenue growth by building a diverse semiconductor equipment portfolio in line with market demand."
