Hanmi Semiconductor (042700.KS) is making a full-scale push into the artificial intelligence (AI) system semiconductor packaging market. Building on the technological prowess that allowed it to dominate the high-bandwidth memory (HBM) equipment market, the company aims to expand its leadership into the fast-growing back-end process domain for system semiconductors.
Hanmi Semiconductor said Thursday that it has launched FC Bonder 3.5, a new piece of equipment for AI system semiconductors, and will supply it to global foundries and outsourced semiconductor assembly and test (OSAT) companies. The move is a strategy to gain an early lead in the 2.5D packaging market, which global big tech firms such as Nvidia and Apple are actively adopting to produce their AI chips.
FC Bonder 3.5 applies a chip-to-wafer (C2W) method that attaches 2.5D logic dies directly to the wafer, allowing it to flawlessly handle large panels and substrates up to 340mm in size. With the "multi-die" structure—which integrates multiple chips such as graphics processing units (GPUs) and HBM into a single package—recently establishing itself as the mainstream approach, the equipment is seen as precisely targeting demand for high-precision tools.
The industry sees a high likelihood that the equipment has been supplied to Taiwan's TSMC and ASE. Hanmi Semiconductor is increasing its points of contact with Taiwan's foundry industry, including participating for the first time in Computex 2026 held in Taipei, Taiwan, earlier this month. By the end of this year, the company plans to accelerate its global expansion through the establishment of a local U.S. subsidiary.
