Hanmi Semiconductor (042700.KS) is accelerating its push into the global outsourced semiconductor assembly and test (OSAT) market by showcasing its next-generation TC bonder dedicated to 2.5-dimensional (2.5D) packaging at Southeast Asia's largest semiconductor exhibition.
Hanmi Semiconductor said Tuesday that it will participate in "SEMICON Southeast Asia 2026," to be held from May 5 to 7 at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur. At the exhibition, the company will display the "2.5D TC Bonder 40" and "2.5D TC Bonder 120," which have emerged as core equipment for artificial intelligence (AI) semiconductor packaging.
The equipment is optimized for 2.5D advanced packaging processes that integrate heterogeneous chips, including graphics processing units (GPUs), central processing units (CPUs), and high-bandwidth memory (HBM), on a silicon interposer. It is considered essential equipment for high-value-added packaging processes such as TSMC's CoWoS (Chip on Wafer on Substrate).
Through the exhibition, Hanmi Semiconductor plans to expand its engagement with global OSAT companies based in Malaysia and Singapore, including Amkor of the United States and ASE of Taiwan, and explore concrete order opportunities.
According to market research firm Yole Group, the advanced packaging market, which includes 2.5D and 3D packaging, is expected to grow at an annual average rate of 9.5%, from the current $46 billion (67.6476 trillion won) to $79.4 billion (110.1479 trillion won) by 2030.
At SEMICON Southeast Asia, Hanmi Semiconductor also plans to showcase its "Micro Saw Vision Placement (MSVP) 6.0 Griffin," which has held the world's No. 1 market share for 23 consecutive years, alongside the 2.5D TC bonder, aiming to maintain the market dominance of its flagship product lineup.
"This exhibition is an important venue to introduce Hanmi Semiconductor's next-generation packaging solutions to major semiconductor companies in the Southeast Asian region," a Hanmi Semiconductor official said. "Through our global marketing efforts extending to Computex Taiwan in June and SEMICON Taiwan in September, we will further solidify our leadership in the AI semiconductor equipment market."
