Hanmi Semiconductor Chairman Kwak Buys Additional $2M in Company Shares

Fulfilling Share Purchase Plan Disclosed Last Month Acquired at 315,407 Won Per Share for Total 3 Billion Won Chairman Kwak Signals Commitment to Responsible Management

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By Lee Seok-jin
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Han Mi Semiconductor Chairman Kwak Dong-shin has purchased a total of 56.5 billion won in company shares since 2023. On the 27th, he completed an additional 3 billion won share buyback. Han Mi Semiconductor - Seoul Economic Daily Finance News from South Korea
Han Mi Semiconductor Chairman Kwak Dong-shin has purchased a total of 56.5 billion won in company shares since 2023. On the 27th, he completed an additional 3 billion won share buyback. Han Mi Semiconductor

Kwak Dong-shin, chairman of Hanmi Semiconductor (042700.KS), has completed a 3 billion won ($2.2 million) purchase of company shares with personal funds, bringing his total treasury stock acquisitions to 56.5 billion won ($41.4 million) since 2023. The move is seen as a signal to the market and shareholders of his confidence in the company's technological capabilities and future growth in the back-end bonder market for high-bandwidth memory (HBM), an artificial intelligence (AI) memory product.

Hanmi Semiconductor disclosed on the 27th that Chairman Kwak Dong-shin had completed the 3 billion won share purchase. The acquisition fulfills the share purchase plan disclosed on March 30. The acquisition price was 315,407 won per share, 6.7% higher than the previous trading day's (24th) closing price of 295,500 won. As a result, Chairman Kwak's stake in Hanmi Semiconductor has risen to 33.57%.

Hanmi Semiconductor is maintaining its market leadership this year by leading the supply of "TC Bonder 4" to global manufacturers as mass production of 6th-generation HBM (HBM4) gets into full swing.

By the end of this year, the company plans to launch the "Wide TC Bonder" to support next-generation HBM production. The Wide TC Bonder is equipment specialized for producing next-generation HBM with significantly expanded die areas compared to existing HBM, and is evaluated as equipment that responds to demand for next-generation AI infrastructure where memory capacity and bandwidth requirements are further increased.

Hanmi Semiconductor is also preparing to release a "2nd-generation Hybrid Bonder" prototype within this year, targeting the hybrid bonding market where full-scale mass production adoption is expected in 2029. In the first half of next year, the company plans to begin full-scale operation of its "Hybrid Bonder Factory" to preemptively secure leadership in the next-generation semiconductor packaging market.

"This share acquisition is a strong expression of Chairman Kwak Dong-shin's will to practice responsible management," a Hanmi Semiconductor official said. "As a 'first mover' in the global semiconductor equipment industry, we will achieve sustainable growth."

Original reporting by Lee Seok-jin for Seoul Economic Daily.

AI-translated from Korean. Quotes from foreign sources are based on Korean-language reports and may not reflect exact original wording.

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